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PCB Fabrication; Proto's, quick turns, and production volumes
Solutions for the entire product lifecycle. Experience makes the difference. Ours has enabled us to build state-of-the-art facilities that are certified to ISO 9001-2000, AS-9100, MIL-P-55110, PRF-31032 and NADCAP and to perfect services that take your idea seamlessly from prototype through fabrication, testing and off-shore volume. Combined with expert engineering support and advanced testing capabilities, you can count on faster time-to-market, quicker ROI, and the ability to optimize your internal resources.
PCB Fabrication
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DDi’s industry-leading engineering teams can mobilize your successful project to meet your time-sensitive requirements utilizing multiple facilities outfitted with advanced equipment and technologies. Whether you have short-term delivery needs or are looking for a repeatable, high-volume manufacturing process, DDi can scale services to meet your project parameters.
Superior technologies yield superior solutions
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Superior technologies yield superior solutions. There’s always a better solution. A faster way to achieve quality results. A more efficient route. A finer way to simplify complex processes. And we’re determined to be that company that uncovers it and puts it to use for you. To that end, we invest millions each year in research and development and collaborate with leading industry partners so that you can achieve your goals of creating next-generation products faster, easier, and with superior results. Here are some of our most recent breakthroughs:
FLAT-WRAP™ Technology
DDi’s Engineering Team has developed a new process – FLAT-WRAP™Technology – that eliminates the need for additional surface plated copper required to meet the IPC specification for wrap plating (ref. IPC 6012B Amendment 1 p. 3.6.2.11.1). FLAT-WRAP™Technology results in consistent wrap plate thickness matching the thickness of the initial surface foil with minimum wrap and copper thickness to be in accordance with IPC 6012B Class 2 or Class 3. FLAT-WRAP™Technology is suited for design applications with multiple wrap plating requirements and fine pitch trace and space on plated layers, typically sequential lam jobs or standard thru hole Via-In-Pad requiring conductive or non-conductive via fill.
Find out more about our FLAT-WRAP™Technology
Signal Integrity
Today’s circuits extend copper interconnects bandwidth by the GHz, making PCB signal integrity crucial to overall performance. We focus on this key aspect at every phase, from concept through production. We ensure this quality by selecting the correct circuit geometries and dialectric materials from the more than 70 that we support; verifying all circuit parameters for specific tolerance using specialized modeling software; and testing using TDRs for the most demanding applications.
Find out more about our Signal Integrity Technology
Power Distribution
Whether your design is a backplane or a high-performance circuit board, increasing circuit densities and speeds are challenging traditional PCB power distribution techniques. Our engineering team has pioneered many techniques to address power delivery, including our ability to process copper up to five ounces; advanced planar buried capacitance materials providing 500 pf to 1500 pf per-square-inch in conjunction with extremely low sheet inductance; and laser and mechanical Via-In-Pad technologies for direct vertical connections without surface traces, providing the lowest possible inductance.
Find out more about our Power Distribution Technology
Thermal Management
Exponential increases in thermal dissipation at the circuit level have prompted us to develop innovative thermal management solutions, such as conductive-cooled PCB’s traditionally fabricated with solid copper cores. Our quest for even higher performance led us to develop lighter weight materials using carbon fiber fabric with thermal conductivities ranging from 10 to >600 w/m*k, making them ideal for aerospace applications.
Find out more about our Thermal Management Technology
RF & Microwave
Circuit miniaturization and enhanced performance levels are redefining tolerances essential for producing printed components, filters, and couplers, as well as precision terminations. Our engineering team has a long history of addressing these challenges with such solutions as engineering resources that include 2D and 3D full-wave finite element modeling capabilities; an extensive selection of RF dielectric materials, including hybrid construction compatibilities; and Laser Direct Imaging capabilities for enhanced resolution and +/- 0.001” registration.
Find out more about our RF & Microwave Technology
High Density Interconnects
These days, electronics companies demand smaller, faster, thinner products with enhanced functionality. And DDi’s pioneering Microvia and Stacked MicroVia (SMV) technologies deliver, making it possible to produce a wide range of products, from handheld electronics like Apple’s iPod Nano, camera phones, navigation systems and computers to medical devices, sonar to wireless LAN and reference designs for fine pitch chip sets.
Find out more about our HDI Technology
RoHS
DDi in conjunction with select OEMs conducted tests on 9 different FR4 materials to determine which were thermally robust enough to survive the higher temperatures of Lead Free Assembly.
The tests included Thermal Stability, Peel Strength, Solder Float, Electrical, Interconnect Stress, Highly Accelerated Thermal Shock, and Conductive Anodic Filament Growth.
Find out more about our RoHS Technology
Technical Library
DDi’s Engineering Team has developed a new process – FLAT-WRAP™Technology – that eliminates the need for additional surface plated copper required to meet the IPC specification for wrap plating (ref. IPC 6012B Amendment 1 p. 3.6.2.11.1). FLAT-WRAP™Technology results in consistent wrap plate thickness matching the thickness of the initial surface foil with minimum wrap and copper thickness to be in accordance with IPC 6012B Class 2 or Class 3. FLAT-WRAP™Technology is suited for design applications with multiple wrap plating requirements and fine pitch trace and space on plated layers, typically sequential lam jobs or standard thru hole Via-In-Pad requiring conductive or non-conductive via fill.
Find out more about our FLAT-WRAP™Technology
Today’s circuits extend copper interconnects bandwidth by the GHz, making PCB signal integrity crucial to overall performance. We focus on this key aspect at every phase, from concept through production. We ensure this quality by selecting the correct circuit geometries and dialectric materials from the more than 70 that we support; verifying all circuit parameters for specific tolerance using specialized modeling software; and testing using TDRs for the most demanding applications.
Find out more about our Signal Integrity Technology
Whether your design is a backplane or a high-performance circuit board, increasing circuit densities and speeds are challenging traditional PCB power distribution techniques. Our engineering team has pioneered many techniques to address power delivery, including our ability to process copper up to five ounces; advanced planar buried capacitance materials providing 500 pf to 1500 pf per-square-inch in conjunction with extremely low sheet inductance; and laser and mechanical Via-In-Pad technologies for direct vertical connections without surface traces, providing the lowest possible inductance.
Find out more about our Power Distribution Technology
Exponential increases in thermal dissipation at the circuit level have prompted us to develop innovative thermal management solutions, such as conductive-cooled PCB’s traditionally fabricated with solid copper cores. Our quest for even higher performance led us to develop lighter weight materials using carbon fiber fabric with thermal conductivities ranging from 10 to >600 w/m*k, making them ideal for aerospace applications.
Find out more about our Thermal Management Technology
Circuit miniaturization and enhanced performance levels are redefining tolerances essential for producing printed components, filters, and couplers, as well as precision terminations. Our engineering team has a long history of addressing these challenges with such solutions as engineering resources that include 2D and 3D full-wave finite element modeling capabilities; an extensive selection of RF dielectric materials, including hybrid construction compatibilities; and Laser Direct Imaging capabilities for enhanced resolution and +/- 0.001” registration.
Find out more about our RF & Microwave Technology
These days, electronics companies demand smaller, faster, thinner products with enhanced functionality. And DDi’s pioneering Microvia and Stacked MicroVia (SMV) technologies deliver, making it possible to produce a wide range of products, from handheld electronics like Apple’s iPod Nano, camera phones, navigation systems and computers to medical devices, sonar to wireless LAN and reference designs for fine pitch chip sets.
Find out more about our HDI Technology
DDi in conjunction with select OEMs conducted tests on 9 different FR4 materials to determine which were thermally robust enough to survive the higher temperatures of Lead Free Assembly.
The tests included Thermal Stability, Peel Strength, Solder Float, Electrical, Interconnect Stress, Highly Accelerated Thermal Shock, and Conductive Anodic Filament Growth.
Find out more about our RoHS Technology
Technical Library